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EMIF03-SIM02F3
3-line IPADTM, EMI filter including ESD protection
Features

EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Lead-free package Very low PCB space occupation: 1.2 mm2 Very thin package: 0.60 mm High efficiency in ESD suppression High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Figure 1. Pin layout (bump side)
3
RST in
Flip Chip (8 bumps)
2
RST ext
1 A
CLK ext
Complies with the following standards:
IEC 61000-4-2 Level 4 on external and Vcc pins: - 15 kV (air discharge) - 8 kV (contact discharge) Level 1 on internal pins: - 2 kV (air discharge) - 2 kV (contact discharge) MIL STD 883E - Method 3015-6 Class 3
RST in
CLK in
Gnd
B C
Data in
VCC
Data ext
Figure 2.
VCC
Device configuration
100 RST ext R1 47
Applications
EMI filtering and ESD protection for:

CLK in R2 100 Data in R3
CLK ext
Data ext
SIM interface (subscriber identity module) UIM interface (universal identity module)
GND
Cline = 20 pF max.
Description
The EMIF03-SIM02F3 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. This filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV.
TM: IPAD is a trademark of STMicroelectronics. April 2008 Rev 3 1/9
www.st.com 9
Characteristics
EMIF03-SIM02F3
1
Characteristics
Table 1.
Symbol
Absolute maximum ratings (Tamb = 25 C)
Parameter and test conditions Internal pins (A3, B3, C3): ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharge External pins (A2, B1, C2, C1): ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharge Maximum junction temperature Operating temperature range Storage temperature range Value Unit
VPP
2 2 15 8 125 -40 to +85 -55 to 150
kV
Tj Top Tstg
C C C
Table 2.
Symbol VBR IRM VRM VCL IPP RI/O Cline Symbol VBR IRM Rd R1, R3 R2 Cline
Electrical characteristics (Tamb = 25 C)
Parameters Breakdown voltage
IF I
Leakage current @ VRM Stand-off voltage Clamping voltage Peak pulse current Series resistance between input and output Input capacitance per line Test conditions IR = 1 mA VRM = 3 V 1.5 Tolerance 20% Tolerance 20% Vline = 0 V, Vosc = 30 mV, F = 1 MHz 100 47 20 Min 6 Typ Max 20 0.2 Unit V A pF
VCL VBR VRM IRM IR VF V
IPP
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EMIF03-SIM02F3
Characteristics
Figure 3.
0.00
S21 (dB) attenuation measurement Figure 4. (A2-A3 line)
dB
0.00
S21 (dB) attenuation measurement (B1-B3 line)
dB
-10.00
-10.00
-20.00
-20.00
-30.00
-30.00
F (Hz)
-40.00 100.0k 1.0M 10.0M 100.0M
a2/a3
F (Hz)
1.0G
-40.00 100.0k
1.0M
10.0M
100.0M b1/b3
1.0G
Figure 5.
0.00
S21 (dB) attenuation measurement Figure 6. (C1-C3 line)
dB
0.00 -10.00 -20.00
Analog crosstalk measurement
dB
-10.00
-30.00 -40.00
-20.00
-50.00 -60.00 -70.00
-30.00
-80.00
F (Hz)
-40.00 100.0k 1.0M 10.0M 100.0M c1/c3 1.0G
-90.00 -100.00 100.0k
F (Hz)
1.0M 10.0M 100.0M Xtalka3/b1 1.0G
Figure 7.
Digital crosstalk measurement
Figure 8.
Line capacitance versus reverse applied voltage (typical)
C(pF)
18
Output Line 2 2mV/d
15 12 9 6
Input Line 1 1V/d
3 0
Bumps A3 (RSTin) and B1 (CLKout)
10ns/d 5Gs/s
0
2
4
6
VR(V)
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Characteristics Figure 9.
EMIF03-SIM02F3 Voltages when IEC 61000-4-2 (+15 kV air discharge) applied to external pin
Vexternal: 10V/d
Vinternal: 10V/d
100ns/d
Figure 10. Voltages when IEC 61000-4-2 (- 15 kV air discharge) applied to external pin
Vexternal: 10V/d
Vinternal: 10V/d
100ns/d
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EMIF03-SIM02F3
Application information
2
Application information
Figure 11. Aplac model
c2 a2 b1 c1 Lbump Rbump Lbump Rbump Lbump Rbump Lbump Rbump 100 47 a3
Rbump
Lbump
Rbump Lbump Rbump Lbump MODEL = Dint1 MODEL = Dint1
b3 c3
100 MODEL = Dext1 MODEL = Dext3 MODEL = Dext1
MODEL = Dext2 Bulk Lbump Rbump
MODEL = Dint2
Lgnd Cgnd Rgnd
Figure 12. Aplac parameters
aplacvar Ls 950pH aplacvar Rs 150m aplacvar Cext1 12pF aplacvar Cext2 14pF aplacvar Cext3 18pF aplacvar Cint1 4.5pF aplacvar Cint2 4pF aplacvar Rbump 17m aplacvar Lbump 43pH aplacvar Rgnd 500m aplacvar Lgnd 50pH aplacvar Cgnd 0.15pF aplacvar Rsub 100m Dint1 BV=15 CJO=Cint1 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.29 VJ=0.6 TT=50n Dext1 BV=15 CJO=Cext1 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.25 VJ=0.6 TT=50n Dint2 BV=15 CJO=Cint2 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.31 VJ=0.6 TT=50n Dext2 BV=15 CJO=Cext2 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.28 VJ=0.6 TT=50n Dext3 BV=15 CJO=Cext3 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.25 VJ=0.6 TT=50n
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Ordering information scheme
EMIF03-SIM02F3
3
Ordering information scheme
Figure 13. Ordering information scheme
EMIF
EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip Chip x = 3: Lead-free, pitch = 400 m, bump = 255 m
yy
-
xxx zz
Fx
4
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 14. Package dimensions
400 m 40
400 m 50
605 m 55 255 m 40
185 m 10
185 m 10 1.17 mm 30 m
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1.17 mm 30 m
EMIF03-SIM02F3
Ordering information
Figure 15. Footprint
Copper pad Diameter: 220 m recommended 260 m maximum Solder mask opening: 300 m minimum
Figure 16. Marking
Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week)
E
Solder stencil opening : 220 m recommended
xxz y ww
Figure 17. Flip Chip tape and reel specification
Dot identifying Pin A1 location 4 0.1 O 1.5 0.1
1.75 0.1 3.5 0.1
1.27
0.69 0.05
All dimensions in mm
8 0.3
STE
STE
STE
1.27
xxz yww
User direction of unreeling
xxz yww
xxz yww
4 0.1
Note:
More information is available in the application notes: AN2348: "STMicroelectronics 400 micro-metre Flip Chip: Package description and recommendation for use" AN1751: "EMI Filters: Recommendations and measurements"
5
Ordering information
Table 3. Ordering information
Marking HA Package Flip Chip Weight 1.74 mg Base qty 5000 Delivery mode Tape and reel 7"
Order code EMIF03-SIM02F3
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Revision history
EMIF03-SIM02F3
6
Revision history
Table 4.
Date 19-Jul-2005 26-Feb-2007
Document revision history
Revision 1 2 Initial release. Changed out to ext in Configuration diagram on page 1. Added Ecopack statement. Reformatted to current layour standard. Updated Application note AN2348 reference and description. Updated ECOPACK statement. Updated Figure 13, Figure 14, and Figure 17. Reformatted to current standards. Changes
28-Apr-2008
3
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EMIF03-SIM02F3
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